PCB DESIGN High-performance characterization boards Load Boards / DUT Cards / ATE Boards Blank Probe Cards -- Generic and Custom Bench, Evaluation and Demonstration Boards Commercial boards Capabilities High-Speed Digital design Mix signal design RF design Controlled Impedance transmission line Minimum Crosstalk Multiple impedance transmission lines to minimize the effect of load capacitance Minimum skew between same signal busses Special routing techniques for high-speed transmission lines Software Cadence Design tool (allegro, PCBrouter) PCAD Design tool Pads Design tool Expedition Router Cam Available Tester Templates Agilent Credence LTX Teradyne Avnet Schlumberger Checksum Nextest Advantest DFM Capability Matrix PCB FABRICATIONS & PCB ASSEMBLY Outsource Fabrication to the top high-end approved worldwide PCB/PWB Fabricators Capabilities Panel / board sizes to 24”x30” (~22”x28” finished) Mixed dielectrics Layers 50 + Max board thickness .300” Drill sizes down to 0.004” BGA pitch to 0.4mm Drill aspect ratios w/o multi-lam 31:1 Min finished lines/spaces .002”/.002” Impedance tolerance +/- 5% Blind and buried vias (Silver fill or non-conductive epoxy fill) Materials Lamination Cycles up to 5 sequential Metal Finishes Ni/Au (hard), Ni/Au (soft), Brt Ni, ENIG Bow & twist available to 0.002in/in Filled Via Flatness +/-.0005 Filled Via Aspect Ratio 31:1 Add On Services DRC in Genesis Net list check Extensive quality control system 1000 Volt electrical test 7 Day standard cycle time – non-filled probe PCBs DFM training for PCB design Stack-Up services Contact for More Information Reach Out Today