High-Quality Semiconductor Test Products

Blair Gordon Associate Inc. is the authorized distributor for Leeno Test Products in North America. Leeno Industrial has led the semiconductor test products industry through innovation in technology and quality control.

IC Test Socket

System Level Test Socket
RF Device Test socket
Large Device Test Socket
High Power Cooling Lid
Memory Device Test Socket
Elastomer Socket
Strip Test Socket
Kelvin Socket

Probe Head

Fine Pitch RF Probe Head
Fine Pitch, Large Pin Count Probe Head
Kelvin Probe Head

Spring Contact Probe

Spring Contact Probe
Coaxial Probe
Non-Magnetic Probe
ICT Probe

LEENO Products

Probe Styles
Pitch from 92 µm to 1.27 mm
Kelvin Probes from .2mm pitch and larger
Specialty Probes
High Current Spring Contactors to 75 amps
Test Sockets — Logic, POP, RF, Coaxial, Elastomer, Memory
Wafer Level CSP and more…

Probe Products

Probe Designations

Example Part Numbers: DB(X)235CAR GX319AMAR-R1 GN102CAR

Test Probe Solutions from 92 µm to 1.2mm pitch and LARGER

New Coaxial Probe to 40 GHz

Prefix - Determines Type of Pin

CY

Lower consistent CRES. Higher spring forces. Improved production yields. Exceptional proven production performance. Used on 0.4mm to 0.8mm pitch probes.

DB

Double ended, 4-pc probe, two moveable plungers. Additional letters, such as A-N, etc. after the DB are strictly for part number extensions and have no added meaning.

GN

Electro-formed barrel. Lower, stable CRES. Available in single and double ended design. Wide range of pitch options starting with very fine.

GX

Single-ended, 3 pc probe, one moveable plunger.

Part Number - The numeric number between the prefix and suffix

Suffix - Tip style (set of letters after numeric numbers)

Specialty Contactors

High Current Contactors to 75 AMPS
Consumer Battery charger contacts
Switch Probes
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New Products

0.80mm Probe

The shortest spring contact probe was specifically designed for high-speed testing purposes.

Large Device Test Socket

Offers test sockets for use on a wide range of packages (i.e., BGA, LGA, QFN, QFP, CSP, TSOP, SOP) and PoP; can be used for Multi-Parallelism, a total solution for the logic test socket.

Fine Pitch RF Probe Head

LEENO can provide fine pitch RF Probe Head for wafer level testing with multi-site & large pin count for device pitch ≥130µm.

Fine Pitch, Large Pin Count Probe Head

LEENO can provide Fine Pitch Large Pin Count Probe Head for wafer level testing with pitch ≥92µm or pin count more than 30K.

Fine Pitch Probe

Thinnest & Shortest Fine Pitch Spring Contact Probes specifically designed for Wafer Level (RF) testing purpose.

Fine Pitch Probe

Thinnest & Shortest Fine Pitch Spring Contact Probes specifically designed for Wafer Level (RF) testing purpose.

Specifications

Barrel diameter ≥75µm
Probe length ≥2.00mm
Spring force ≥3.00g (Customized)
Frequency ≥50Ghz

Product Series

0.80mm Probe

Shortest Spring Contact Probe specifically designed for High Speed testing purpose.

Specifications

Pitch ≥0.30mm
Spring Force Avg. 9.3g (0.30mm Pitch)
Stroke 0.25mm

Product Series

Pitch (mm) 0.30
Pin Count 1,XXX pin
Type Non Floating Type

Pitch (mm) 0.30
Pin Count 1,XXX pin
Type Floating Type

110Ghz Actual Measurement Capability

Equipped with N5244B/N5292A PNA-X, LEENO provides customers with actual measurement data for given RF specifications by utilizing specially designed LEENO measuring Jigs.

Specifications

Frequency 110Ghz(2-Port) / 43Ghz(4-Port)
Pitch ≥0.30mm
Pin Map GGSGG, GSG, GS

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